Call For Papers
Outstanding papers with extension will be invited to ITC’21.
With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated in Taipei in 2017, and the 5th ITC-Asia will be held in Shanghai China in 2021 and co-located with China Fault Tolerant Computing Conference. Attendee can involve themselves in not only the state-of-the-art test technology trend, but also numerous industry / hot topic forums organized by China Fault Tolerant Computing Conference.
Topics of Interests
include (but are not limited to) the following topics:
- Hardware Oriented Security and Thrust
- Design Validation and Debug
- ATE Design
- Analog and Mixed-SignaTest
- RF Test
- High-Speed I/O Test
- Fault Modeling and Simulation
- ATPG (Automatic Test Pattern Generation)
- Design for Testability
- Built-In Self-Test
- Delay Test
- System-on-Chip Test
- Test Compression
- Power-Aware and/or Thermal-Aware Test
- Memory Test, Diagnosis, and Repair
- Fault Diagnosis and Failure Analysis
- Yield Analysis and Learning
- Safety and Test for Automotive Ics
- Test for Internet of Things
- Test for Emerging Devices
- CPU/GPU Test
- MEMS/Sensor Test
- Online Test
- On-Chip Measurement
- SiP, 2.5D, and 3D IC Test
- Interconnect Test
- Board-LeveTesting and Diagnosis
- Test Standards
- Test Economics
- Reliability Issues
- Fault Tolerance
- Test for Reconfigurable Systems
- Software Test and Reliability
- Dependable Systems and Networks
